[hpsdr] Hot ADC

[Kjell Karlsen]

Dale:

The temps you recorded shows that your boartd is OK. I think this is the  
situation for most of the boards. It is very difficult to see througt the  
small via holes if the solder has flown under the ADC. When I do the PCB  
layout, I always place a 2.5mm hole in the middle of the groundpad for the  
chip. I solder the components on the board manualy and then I need this  
hole to do the job properly. It also makes it easy to verify the the  
result after reflow soldering.

One question: Are the HPSDR Boards delivered from TAPR produced with  
unleaded Solder (acc. to EU RoHS Directive)?
I know that a company here in Norway producing equipment for the Space  
Industry has banned unleaded soldering due to quality problems.
As long as the HPSDR cards are delivered as kits, I do not thing they need  
to be  RoHS compliant.

Kjell, LA2NI





På Wed, 14 Jan 2009 01:39:20 +0100, skrev Dale Boresz  
<dmb at lightstream.net>:

> Just another set of data points ...
>
> Using a small thermocouple, I measured 62 C on the top of the ADC, and  
> 66 C on the foil pad on the back of the board. Ambient temp in the area  
> of the boards is about 26 C. Measurements made after approx. 30 minutes  
> of operation.
>
> Dale
> WA8SRA

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