[hpsdr] LTC 2208 A/D Thermal Characteristics

[Rob Frohne]

That is very reassuring.  Thanks Phil.

73,

Rob

Philip Covington wrote:
> On Wed, Jan 14, 2009 at 6:20 AM, Rob Frohne <frohro at wallawalla.edu> wrote:
>
>   
>> Most of the heat generated by the LTC2208 is transferred
>> from the die through the bottom-side exposed pad. For
>> good electrical and thermal performance, the exposed
>> pad must be soldered to a large grounded pad on the PC
>> board. It is critical that the exposed pad and all ground
>> pins are connected to a ground plane of sufficient area
>> with as many vias as possible.
>>
>> The interesting thing is that their example board didn't contain any vias to the ground plane that I could see anyway, so it seems that they didn't follow their own advice, or maybe I'm blind.  :-)
>>     
>
> They are there.  There are very small vias on the demo board in the
> thermal pad area.  The LVDS version even uses a special black solder
> mask to help in radiating away the heat since the operating the
> LTC2208 in LVDS mode generates the most heat.  I talked to Linear Tech
> people extensively about heat dissipation when I was designing the
> QS1R.
>
> Phil N8VB
>   

-- 
Rob Frohne, Ph.D., P.E.
E.F. Cross School of Engineering
Walla Walla University
100 SW 4th Street
College Place, WA 99324
(509) 527-2075			 http://people.walllawalla.edu/~rob.frohne

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