<html><div id="eml-cke__body" title=""> Hello!<br />
I agree with Helmut ;-) I think it's would be the best way to split new Hermes to separate boards. If RF side would be without changes, then "CPU" side ask for improvement each few years. Then you can change "CPU" board and drive further. And solder main BGA on small board will be best and cheapest way. And split ADC board as well. Not every body will want diversity, then it's possible to ad just one board and make it cheaper. And more advantages ;-)<br />
<br />
<br />
Aivars. YL2GVC</div>
<div id="eml-cke__signature_top" title="Paraksts">
<div class="eml-cke__signature" id="eml-cke__signature_top-wrap" title=""> </div>
</div>
<div id="eml-cke__signature_bottom" title="Paraksts"> </div>
</html>