[hpsdr] [OT] Shipping container overload

[Christopher T. Day]

I've been musing on the idea that nobody seems to be using the FX2 as
anything but a mindless USB engine. I personally would like to see it
used to provide a USB interface that follows the USB spec for Audio
Devices. I presume I'll have to do that myself, but it's slow going so
far. Anyway, the idea arose in my head that the 16KB of on-board RAM
might not be enough. So, for potential future use, I asked Cypress for a
sample of the 128-pin version that allows off-chip RAM - strictly for my
own amusement at this point.

 

So, to the point: when the sample arrived, it was enclosed in the most
elaborate shipping package I have seen so far. The package is about 6.5"
x 13" in a vacuum sealed aluminized bag with a big sticker announcing
that it contains a Level-3 Moisture Sensitive Device - Do Not Open
Except Under Controlled Conditions. The somewhat illegible text goes on
to say that the device should last a year if the bag is unopened and
kept below 260C, but if reflow soldered or other high temperature
process is used, it must be done within 168 hours of opening if the
weather ain't right (not their words) or baked or a bunch of other
stuff. It also includes the interesting information that the chip lived
free for 4 hour and 20 minutes between manufacturing and package
sealing.

 

>From my quick Googling, this all seems to have been brought on by the
Pb-free initiatives and consequent higher soldering temperatures with
worries that steam production could damage the part. My question is:

 

            If I use a soldering iron as we usually do, should I worry
about all this?

 

Thanks.

 

 

            Chris - AE6VK

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