[hpsdr] [OT] Shipping container overload

[Eric Blossom]

On Wed, Mar 15, 2006 at 11:26:47AM -0800, Christopher T. Day wrote:
> ***** High Performance Software Defined Radio Discussion List *****
> 
> I've been musing on the idea that nobody seems to be using the FX2 as
> anything but a mindless USB engine. I personally would like to see it
> used to provide a USB interface that follows the USB spec for Audio
> Devices. I presume I'll have to do that myself, but it's slow going so
> far. Anyway, the idea arose in my head that the 16KB of on-board RAM
> might not be enough. So, for potential future use, I asked Cypress for a
> sample of the 128-pin version that allows off-chip RAM - strictly for my
> own amusement at this point.

FYI, the FX2 is pretty slow.  Although clocked at 48 MHz, it really peaks
at 12M (simple) instructions per second.

> So, to the point: when the sample arrived, it was enclosed in the most
> elaborate shipping package I have seen so far. The package is about 6.5"
> x 13" in a vacuum sealed aluminized bag with a big sticker announcing
> that it contains a Level-3 Moisture Sensitive Device - Do Not Open
> Except Under Controlled Conditions. The somewhat illegible text goes on
> to say that the device should last a year if the bag is unopened and
> kept below 260C, but if reflow soldered or other high temperature
> process is used, it must be done within 168 hours of opening if the
> weather ain't right (not their words) or baked or a bunch of other
> stuff. It also includes the interesting information that the chip lived
> free for 4 hour and 20 minutes between manufacturing and package
> sealing.
> 
> >From my quick Googling, this all seems to have been brought on by the
> Pb-free initiatives and consequent higher soldering temperatures with
> worries that steam production could damage the part. My question is:

This is standard packaging for non-trivial SMT devices.  What's in the
bag is a standard sized tray containing your device(s).  The trays
are used to provide proper alignment so they can be "picked and
placed" by the SMT placement equipment.  The moisture warning is
because if they get moist they explod when reflowed.  If they do get
moist then they need to be "baked" to dry them back out prior to
reflow.  It the high temperature gradiant in the reflow that's a problem.

> If I use a soldering iron as we usually do, should I worry
> about all this?

Solder away ;)

Eric

 1142451950.0