[hpsdr] A/D thermal

[George Medakovich]

What do you look for?  Should there be a soldered connection between the 
underneath of the
chip and thru holes to the solder pad on the other side?

George, ae5ci

FRANCIS CARCIA wrote:
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> Hi,
> Thanks for the solder information. I'll throw mine under the 
> microscope and give it a close look. Yes, This could be a quality 
> issue but I think I can save TAPR the trouble and reflow my part if 
> there is a problem. My pad is pretty warm so I think the A/D was 
> installed properly. Solder paste doesn't flow through the VIAs to 
> the bottom. Adding solder and filling the holes will improve heat 
> flow. Us as a group should have spotted the possible thermal issue 
> before the board was produced. I say we cut TAPR a break because I 
> value their support. Who is going to pay? We are hams here.
> As Phil said the main heat path is out the bottom and needs a good 
> path away from the part. I bet it won't take much copper connected to 
> the pad to cool it down.  Frank WA1GFZ
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