[hpsdr] A/D thermal

[Geoff Matthews]

Hi Frank et al,

I wonder how much room is available under the card according to the original
HPSDR card standard? If you want to retain the ability to use all 6 slots on
Atlas it will be handy to know. I've just done a bit of fishing around and I
haven't found that dimension.
73 de Geoff vk2tfg.

On Wed, Jan 14, 2009 at 10:48 AM, FRANCIS CARCIA <carcia at sbcglobal.net>wrote:

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>
> Hi,
> Thanks for the solder information. I'll throw mine under the microscope and
> give it a close look. Yes, This could be a quality issue but I think I can
> save TAPR the trouble and reflow my part if there is a problem. My pad is
> pretty warm so I think the A/D was installed properly. Solder paste doesn't
> flow through the VIAs to the bottom. Adding solder and filling the holes
> will improve heat flow. Us as a group should have spotted the possible
> thermal issue before the board was produced. I say we cut TAPR a break
> because I value their support. Who is going to pay? We are hams here.
> As Phil said the main heat path is out the bottom and needs a good path
> away from the part. I bet it won't take much copper connected to the pad to
> cool it down.  Frank WA1GFZ
>
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