[hpsdr] Penny Solder stencils

[Neal Campbell]

I was going to use a hotplate and assumed that the parts already
soldered that are now on the bottom would either move or fall off or
prevent enough surface contact for the board to heat up for the top
components. Will this work if I am using a hot plate instead of a hot
air solderer or a reflow oven?

73
Neal Campbell
Abroham Neal Software
Programming Services for Windows, OS X and Linux
www.abrohamnealsoftware.com
(540) 242 0911




On Fri, Mar 6, 2009 at 4:35 AM, Gerd Loch <g.loch at nt-electronics.de> wrote:
> Hi Neal,
>
> where are your problems?
>
> Normally you solder first the solderside (where only capacitors and
> resistors are placed) with this side up.
> You can use hotair or a IR reflow oven. Then you assemble the component side
> and solder it in the same way. The components on the solder side are then
> upside down. Even if the solderpaste on the bottom side becomes liquid again
> the components keep adherent through the solderpaste.
>
> Manual assembly is normally done by me with a fine soldertip part after
> part.
>
> Gerd, DJ8AY
>
>
>
>
> Message: 1
> Date: Wed, 4 Mar 2009 18:41:27 -0500
> From: Neal Campbell <nealk3nc at gmail.com>
> Subject: [hpsdr] Penny Solder stencils are on the way
> To: High Performance Software Defined Radio Discussion List
>        <hpsdr at hpsdr.org>
> Message-ID:
>        <325413300903041541h6efbb9ddpebad6cece1b91fbb at mail.gmail.com>
> Content-Type: text/plain; charset=ISO-8859-1
>
> So, I have my Penny partial kit, the parts kit from John on the way, a good
> supply of kester solder paste and Polulu mylar templates shipped today. I
> kinda figured out that I will not be able to do both sides of the board with
> a hotplate after I ordered the front and the back stencils but...
>
> Does anyone have a recommendation on a good hot plate for this venture?
>
> 73
> Neal k3nc
>
>
> ************************************
>
>

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