[hpsdr] [OZY] QFP or BGA?

[Ahti Aintila]

NO!, NO!!, NO!!! for BGAs. And I have been doing wafer bumping for BGA
packages! Stay in peripheral connections. To me even the flip-chip
assembly with 4 mil pitch peripheral bumps feels easier than grid
array bumps with wider pitch. Also the circuit board layout will
remain simpler. Nothing beats the leaded packages. (In this context
"lead" is  not same as Pb)

Ahti OH2RZ

On 11/05/06, Ray Anderson <ray.anderson at xilinx.com> wrote:
> ***** High Performance Software Defined Radio Discussion List *****
>
>
>
>
> > Let's have a yes/no vote on using BGAs in the HPSDR project.
>
>
> Clock in another NO vote on BGAs if there are any other viable
> solutions. Granted, BGA parts will eventually need to be dealt with on
> some of the planned designs but in those cases where there are
> alternatives let's try to stick with the non-BGA solution.
>
> While I am sure they _could_ be mounted in a non-professional
> environment, I'm not sure I'd count on doing it successfully multiple
> times. Leaded or semi-leaded devices are so much easier to deal with
> either with hot-air or toaster oven technology (or even a soldering
> iron..)
>
> I'm going to talk to some of our BGA rework people and see what they
> recommend for mounting BGAs outside of a production environment.
>
> -Ray   WB6TPU
>
>
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