[hpsdr] Tapr hombrew hermes need corrections for new builds (update BOM & Schematic ?)

[Mike Collins]

On 2/20/2013 8:36 AM, Gloria Koch wrote:
>
>
> On my BOM (1010_HERMES_PROD_BOM_08112012.xls) C37 is listed as a
> 33pf and there is only ONE instance of it. There is no C70, C228, nor 
> C229 on
> my BOM as mentioned however item 15 is a 47nf cap not 1nf on my BOM.
>
> So I'm not sure what I need to do for the correct values of C70, C228 
> and C229?
>
> 10    A0010    2    08055A330JAT2A    33pf    (C37,C39) 805    AVX    
> DigiKey    478-1310-6-ND
> 15    A0019    1    08055C473KAT2A    47nF    C150    805 AVX    
> DigiKey    478-1391-1-ND
>
> Also, dealing with the fuses, on my BOM F1, F2, and F3 are all 2 amp 
> fuses, where
> Stijn mentions all 3 of his are different. Are the 2 amp fuses OK to use?
>
> 36    A0034    3        2A    F1,F2,F3    1812    Bel Fuse DigiKey    
> MF-MSMF110/16-2CT-ND
>
> It appears the BOM and Schematic needs to be updated. Am I missing any 
> other changes?
>
Hi Rick,

Not sure I see anything wrong with the Item 15,  C150 line you listed.

Here is my notes (I could be wrong) on the referenced BOM:

Item 9:   added C70  1nF from schematic value (Abhi says it is 100nF), 
looks like 1nF cap on TAPR build
Item 10:  C37 not on board, C39 is dup item 8 on line 44
Item 18: Part Number  08055C473KAT2A should be 474
Item 19:  Digikey part is 10V, OK for all but C194 is on 12Vbus so need 
16V or higher.
Item 32: Part number RLP-50+ should be 40+
Item 92:  Part number CRCW080512K0FKEA should be 63.4K
Item 101:  Digikey M25P16-VMN6TPCT-ND should be VMW, PCB Footprint 
SOIC-8 should be SO8W
Item 122: Part number LT3680EDD#PBF shoud be LT3680EMSE#PBF, PCB 
Footprint DFN (UPDATED) should be MSOP8

Still working on my soldering of my build.  Having better luck when 
tinning both board and device pads for U13, 58, 10, 11, 12, and 21.
Everything else OK with handsoldering.  Might need to reflow U23 again.

73,  Mike Collins   KF4BQ




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