[hpsdr] Tapr hombrew hermes need corrections for new builds (update BOM & Schematic ?)

[Stijn Nestra]

Hello Mike,

I do agree on most of your points, except for item 101. SO8N is the 
correct outline for the board, so DigiKey number M25P16-VMN6TPCT-ND is 
correct and column D and E of the BOM are incorrect. VMW is not going to 
fit.

73, Stijn
Op 20-02-13 16:16, Mike Collins schreef:
> On 2/20/2013 8:36 AM, Gloria Koch wrote:
>>
>>
>> On my BOM (1010_HERMES_PROD_BOM_08112012.xls) C37 is listed as a
>> 33pf and there is only ONE instance of it. There is no C70, C228, nor 
>> C229 on
>> my BOM as mentioned however item 15 is a 47nf cap not 1nf on my BOM.
>>
>> So I'm not sure what I need to do for the correct values of C70, C228 
>> and C229?
>>
>> 10    A0010    2    08055A330JAT2A    33pf    (C37,C39) 805    AVX    
>> DigiKey    478-1310-6-ND
>> 15    A0019    1    08055C473KAT2A    47nF    C150    805 AVX    
>> DigiKey    478-1391-1-ND
>>
>> Also, dealing with the fuses, on my BOM F1, F2, and F3 are all 2 amp 
>> fuses, where
>> Stijn mentions all 3 of his are different. Are the 2 amp fuses OK to use?
>>
>> 36    A0034    3        2A    F1,F2,F3    1812    Bel Fuse DigiKey    
>> MF-MSMF110/16-2CT-ND
>>
>> It appears the BOM and Schematic needs to be updated. Am I missing 
>> any other changes?
>>
> Hi Rick,
>
> Not sure I see anything wrong with the Item 15,  C150 line you listed.
>
> Here is my notes (I could be wrong) on the referenced BOM:
>
> Item 9:   added C70  1nF from schematic value (Abhi says it is 100nF), 
> looks like 1nF cap on TAPR build
> Item 10:  C37 not on board, C39 is dup item 8 on line 44
> Item 18: Part Number  08055C473KAT2A should be 474
> Item 19:  Digikey part is 10V, OK for all but C194 is on 12Vbus so 
> need 16V or higher.
> Item 32: Part number RLP-50+ should be 40+
> Item 92:  Part number CRCW080512K0FKEA should be 63.4K
> Item 101:  Digikey M25P16-VMN6TPCT-ND should be VMW, PCB Footprint 
> SOIC-8 should be SO8W
> Item 122: Part number LT3680EDD#PBF shoud be LT3680EMSE#PBF, PCB 
> Footprint DFN (UPDATED) should be MSOP8
>
> Still working on my soldering of my build.  Having better luck when 
> tinning both board and device pads for U13, 58, 10, 11, 12, and 21.
> Everything else OK with handsoldering.  Might need to reflow U23 again.
>
> 73,  Mike Collins   KF4BQ
>
>
>
>

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